Velocity is our imperative. For customers, this means more predictable development cycles, faster time to yield, and a partner positioned to scale alongside them. Learn why this matters more now than ever. https://bit.ly/4uJYWC7

At sub-2nm nodes, tighter control over interconnect variability is critical. Through virtual DOE and process modeling, we simulated the key parameters and process windows needed to control resistance and capacitance in advanced interconnects. Explore the results. https://bit.ly/3CIBOhD

Let’s rewind to 2010, when global semiconductor sales surged to ~$300B and we introduced the SABRE® 3D ECD system. ⬇️

AI-driven workloads stretch package sizes beyond the limits of traditional wafer-based economics, accelerating interest in panel-level approaches. EVP/COO Sesha Varadarajan notes, “We are in the era where packaging is as important to continued scaling as everything else.” ➡️ https://bit.ly/3QvBWYL

AI’s rapid expansion pushes DRAM demand beyond supply — speed is the new constraint. With tools like Akara®, Aether®, and Striker®, we enable faster paths to production readiness where it matters most. Tap the link for more. https://bit.ly/4cL24GE

Our Word of the Week describes a small structure with a big job: enabling the speed and accuracy behind modern memory systems. Do you know what it is? Take a guess and see if you were right below!

Three cheers for three years of wins! ALTUS Halo® and Akara® have been recognized with Edison Awards for their impact on AI era chipmaking. https://bit.ly/4cS1V5C

The next phase of semiconductor manufacturing is being shaped by sensor-driven intelligence and advanced analytics. Hear more from Lam Research’s Russell Dover, head of Equipment Intelligence Services®. https://bit.ly/4naT0j2

VECTOR® brings big-league film quality, uniformity, and precision to every wafer. Check out the stats. https://bit.ly/48x8rvY

Behind every powerful chip is a network making it all work. ⚡ These tiny pathways keep everything connected and moving with precision. Can you guess the term(s) that define these pathways?

What if process challenges could be solved before they reach the fab? With VizGlow®, engineers simulate plasma behavior with higher accuracy and speed, helping refine processes for etch, deposition, and cleaning earlier in the design cycle. 🖌️ Learn more. https://bit.ly/3OgCbT3

As fabs scale to meet the needs of AI demand, maintenance consistency becomes even more essential. Meet Dextro™, our collaborative robot, or cobot, bringing repeatable precision to cleaning and parts replacement where it matters most. https://bit.ly/3OON1DL

The shift to 3D is one of the biggest changes in chipmaking. Taller stacks, higher aspect ratios, and new materials are driving new approaches in deposition and etch technology. Learn more. https://bit.ly/4cpSiL4

This technique uses an electrical current and a chemical bath to form a thin, uniform metal coating on a wafer. 🙌 Watch the video to reveal our Word(s) of the Week.

Small design choices can have a big impact on wafer-level results. We examine how techniques like dummy patterning and layout optimization give engineers greater control over etch behavior. Dive in. bit.ly/4vxhUNL

Scaling chips to 2nm or below is about more than just shrinking features — it reshapes how chips are built and optimized. These changes introduce constraints, requiring teams to adjust across design, process, and integration at the same time. See how. https://bit.ly/47QVhcJ

One wrong move and the SAQP process turns small variations in mandrel and spacer dimensions into big defects. See how we used Monte Carlo virtual fabrication to evaluate interactions among process variables that influence pitch walk and minimize defects. https://bit.ly/4sAKwCY

Next-gen DRAM moves fast — precision can’t slow it down. Which tool extends single print EUV patterning while cutting cost and complexity? Watch to reveal the solution accelerating advanced memory. ⬇️

Not all etch or deposition processes follow a straight path. Sometimes, these processes occur equally in every direction. What term captures this kind of behavior? Watch to find out.

Virtual twins allow engineers to simulate real-world processes without relying on physical testing, accelerating development cycles, reducing resources used, and lowering overall carbon footprint. Learn more. https://bit.ly/423tYZj

The iPhone wasn’t the only breakthrough to emerge in 2007. Take a look back at what we launched that same year to enable next-generation devices.

The road to faster, smarter devices depends on DRAM’s evolution. 🛣️⚙️ From early 2000s breakthroughs to today’s high-speed innovations, the journey continues. Here’s what’s ahead.

Our Word of the Week is a key player in controlling current flow within a transistor — activated by voltage to regulate what gets through. Can you guess what it is?

Dextro™ handles repetitive, time-intensive maintenance tasks, so engineers can focus on what matters most — driving innovation. Discover how our cobot enables more efficient fabs. https://bit.ly/4sr5Smf

Our deposition and etch tools give manufacturers the precision needed for 3D DRAM memory. Watch the full video to learn how. https://bit.ly/4s2bJOJ

Velocity = speed + direction. See how Lam is increasing velocity in everything we do to enable the AI era, atom by atom. https://bit.ly/41cuAf0

As MEMS technology advances, the transition to 300mm wafers enables improved performance and new applications. Explore how we are supporting that shift with advanced tools and virtual development approaches. https://bit.ly/3NUeYK2

What if you could see stress before it breaks your chip? 🛠️ SEMulator3D® lets engineers virtually track mechanical stress evolution through each process step — backtracking issues, testing material tweaks, and optimizing designs. Learn more via the blog. https://bit.ly/3ECeCCO

Learn why hybrid bonding is key to enabling 3D integration for next-generation SRAM/processor stacks used in HPC and multi-tiered 3D NAND devices. https://bit.ly/4sLpm5Y

Wondering what makes Sense.i® a top pick in the fab? We have the answer below. https://bit.ly/4dkZcls

What’s small, essential, and always in use? Our Word of the Week! Watch to reveal.

2nm brings new power benefits but also new challenges in thermal behavior and integration. Multi-die assemblies help balance these tradeoffs as the industry looks for more flexible and efficient ways to scale. https://bit.ly/4lrABNS

Lam has been named one of the World’s Most Ethical Companies by Ethisphere™ for the fourth straight year. https://bit.ly/4bBxwX4

Data doesn’t wait — and neither does DRAM. As data demands increase, we leverage our close-to-customer advantage to deliver precision tools and technologies that accelerate memory innovation, helping new breakthroughs move from development to production faster. https://bit.ly/4kPApYR

High-aspect-ratio holes, multi-layer stacks, and sub-nanometer features push 3D NAND to its limits. Advanced metrology, IRCD, X-ray, and high-energy e-beam make it possible to map, inspect, and optimize every layer. Learn more. https://bit.ly/4sOoBsB

We uncovered a time capsule from 2004! That year, Gmail launched, the industry reached the 90nm technology node, and we introduced the first ALTUS® tungsten barrier CVD system. Take a look inside.

As FinFET devices become more complex, accurate modeling matters. Explore more about how calibrated virtual fabrication helps engineers predict real device profiles more reliably and make better process decisions earlier. https://bit.ly/4lkV9HT

Multiple chips. Different functions. One unified system. Our Word(s) of the Week is a packaging technology that shrinks complexity and amplifies performance, all in a single module. Can you guess what it is?

Materials engineering makes tomorrow’s technologies possible. 🚀 As we enter the era of AI, engineers look to silicon photonics to deliver faster and more efficient computing. Discover how our advanced etch systems, like Kiyo® FX, meet photonics demands. https://bit.ly/4sOz879

As AI drives data center energy use upward, GaN offers a path to better efficiency and higher performance. Moving GaN manufacturing to 300 mm wafers brings improved control, higher capacity, and stronger device performance. https://bit.ly/4b8Zp8I

We turn innovation into impact with atomic-level precision, helping our customers unlock breakthroughs fast. Which tool sculpts ultra-precise etches with atomic-scale control and higher aspect ratios for next-gen devices? Reply below if you get it right!

Before engineers etch, deposit, or define anything, this step determines the outcome. It quietly shapes everything that follows. Any guesses for this week’s Word of the Week?

Who knew cleaning could shrink your carbon footprint? 🧹 By optimizing the plasma chamber clean in collaboration with STMicroelectronics, we cut NF3 use by a third and reduced CO2e emissions — all without slowing production. https://bit.ly/4kZO66Q

Advanced packaging is making new levels of performance possible, and tools like SABRE® 3D help bring it to life. From forming clean through silicon vias (TSVs) connections to creating uniform microbumps for stacked dies, SABRE® 3D supports the architectures behind next-generation chips.

For us, 1998 was all about making copper deposition possible — enter the SABRE® ECD system. Discover what other game-changing technology emerged this year. ⬇️

Take our Word(s) of the Week quiz. 👀 Make your guess, then watch the video to see if you got it right.

2nm chips are here, bringing new levels of device complexity. See how the industry is preparing for this next node and the innovations making it possible. https://bit.ly/4rdcULx

As AI workloads grow, materials engineering is becoming a critical driver of semiconductor progress. Dive deep on how atomic-layer deposition and hybrid dielectrics support higher aspect ratios, tighter pitches, and complex 3D device structures. https://bit.ly/4kQo5r7

As memory moves to tighter pitches and taller stacks, Lam’s Aether® dry resist technology helps enable DRAM scaling and HBM with TSVs by avoiding liquid collapse mechanisms, cutting defects, and supporting uniform, single-print patterns. Learn more. https://bit.ly/4tBFAQ6

Ever notice how sticky notes fall if you don’t keep them pressed down? DRAM works the same way, keeping data close to the processor. At Lam, we bring velocity to DRAM innovation with precision etch and deposition technologies optimized for speed, yield, and performance. https://bit.ly/4kPApYR