Take our Word(s) of the Week quiz. 👀 Make your guess, then watch the video to see if you got it right.

2nm chips are here, bringing new levels of device complexity. See how the industry is preparing for this next node and the innovations making it possible. https://bit.ly/4rdcULx

As AI workloads grow, materials engineering is becoming a critical driver of semiconductor progress. Dive deep on how atomic-layer deposition and hybrid dielectrics support higher aspect ratios, tighter pitches, and complex 3D device structures. https://bit.ly/4kQo5r7

As memory moves to tighter pitches and taller stacks, Lam’s Aether® dry resist technology helps enable DRAM scaling and HBM with TSVs by avoiding liquid collapse mechanisms, cutting defects, and supporting uniform, single-print patterns. Learn more. https://bit.ly/4tBFAQ6

Ever notice how sticky notes fall if you don’t keep them pressed down? DRAM works the same way, keeping data close to the processor. At Lam, we bring velocity to DRAM innovation with precision etch and deposition technologies optimized for speed, yield, and performance. https://bit.ly/4kPApYR

Ready for another Word of the Week? Today, we explore high-NA EUV lithography. ⬇️ Discover how our dry resist technology, like Aether®, makes it possible. https://bit.ly/4gMXYh4

As DRAM becomes more complex, we recognize the need to more closely align with our customers. That means expanding our presence in Boise to work directly with our customers on integration and yield challenges. https://bit.ly/4rhl1qk

What gives devices their “working memory”? DRAM! Tiny capacitors storing bits that need a constant refresh. The memory roadmap points to higher bandwidth (DDR5), TSV-enabled HBM, and a shift toward 3D DRAM to feed AI and other data-hungry workloads. https://bit.ly/4kwGNnG

We have formed a multi-year partnership seeking to deepen collaboration to fast track materials and process innovation for power devices, photonics, and other specialty technologies that support AI data center efficiency. https://bit.ly/4qww0uQ

Happy Valentine’s Day from all of us at Lam! 💗

Making an impact goes far beyond company walls. As part of our 2025 Deliver Joy campaign, see how our employees, friends, and families gave back to their communities around the globe. ⬇️

We asked the kids of Lam to define semiconductor terms at the Bring Our Children to Work Day gathering. First up: shallow trench isolation!

Say hello to SABRE® 3D. 👋 This product family delivers reliable, high-quality electroplating for advanced packaging. Take a look at what it has to offer. https://bit.ly/46T6old

It’s hard to imagine a digital world without DRAM. As the backbone of computing for decades, it powers everything from early PCs to today’s AI systems. Step back to the late 1960s and explore DRAM’s early days. ⬇️

Virtual fabrication reveals why dies on a wafer platform vary. By modeling etch rates, thickness, and device metrics, engineers can predict variation and test recipes before costly physical experiments. https://bit.ly/3ZmIFWd

This week’s Word of the Week, patterning, puts tiny details front and center. Our advanced lithography, deposition, and etch processes turn intricate designs into the precise, densely packed features that power today’s semiconductors. Check out our patterning solutions: https://bit.ly/45nsJ9x.

🔔📲 New notification: ALTUS® Halo pushes semiconductor metallization forward! Watch the video to see how. bit.ly/4mrZg3N

One layer at a time, chips are getting more ambitious. Counterpoint Research explores how molybdenum-based metallization supports scaling in advanced 3D memory and logic. Check it out! https://bit.ly/4jM9wEr

Ever wonder what’s driving the next big wave in AI? It’s not just smarter algorithms; it’s the advanced packaging that brings more power and efficiency to every chip. Guest author Bob O’Donnell explains more in the blog. https://bit.ly/3XWeKn7

Happy New Year from all of us at Lam! 🎉 To kick off the year, let’s look back at what we achieved in 2025. ⬇️

Next-gen AI starts at the chip level. In this TechArena podcast, Managing Director Chee Ping Lee shares how advanced packaging and hybrid bonding power what’s next. Tune in now. 🎧 https://bit.ly/3YZz48M

Happy holidays! Can you guess our next Word of the Week? (Hint: It has to do with “wrapping” a chip.) https://bit.ly/3L2qilH

With all the buzz around high bandwidth memory (HBM) — and the AI driving its demand — this breakdown shows how it all comes together as if it were a simple DIY project. 🔨⚙️ https://bit.ly/3JwZ0CM

Happy holidays! We look forward to driving innovation together in 2026.

Molybdenum clears bottlenecks in AI chips, and ALTUS® Halo ensures every connection in dense 3D architectures performs at its peak. Tap the link to learn more. https://bit.ly/4k7Uisg

1993 marked a major leap in technology — a typical microprocessor hit 3.1M transistors, and we introduced the Concept Two® ALTUS® CVD tungsten system, advancing how chipmakers built the next generation of devices.

What’s an ashable hardmask, and why do we use it? Check out our next Word(s) of the Week to find out. ⬇️

Think making chips smaller just means “zooming in”? Try scaling below one angstrom. 🔎 Learn how our advanced patterning tools turn “impossible” dimensions into everyday manufacturing. https://bit.ly/4oVFAYI

Oregon’s semiconductor ecosystem is a powerful engine for talent and ideas. From university partnerships to technical training programs, Building G strengthens our ability to engage academia and the next generation of innovators. https://bit.ly/3LPRqVj

Layer by layer, chipmaking magic happens. ✨ Deposition turns plasma and precision into the building blocks of advanced manufacturing, and we’ve been perfecting it for decades. Learn how via the blog. https://bit.ly/4078QSi

Akara® has entered the game. 🕹️ By leveraging DirectDrive®, a solid-state plasma source, Akara® delivers etch process control and responsiveness once thought impossible. Learn more. https://bit.ly/47I5iYK

The Word of the Week is void — a gap where material is missing, which can interrupt conductivity and affect overall yield. Detecting and preventing these microscopic defects helps ensure every layer performs exactly as designed.

In the world of 3D chipmaking, Akara® is the real star. ⭐🎬 Here’s an inside look into CVP Gowri Kamarthy’s discussion with Counterpoint Research — out now. https://bit.ly/3Jj4D8h

Some masks hide identities, but ours help define them. In chipmaking, a mask protects select wafer areas during processing, guiding where intricate patterns will form before it’s lifted away.

Dry resist, great under pressure, and built for single print patterning. Aether® keeps things simple but never ordinary. See why it earns an “A+” in advanced nodes. https://bit.ly/47JwDuR

3D transistor is more than a buzzword — it represents a new direction for the future of semiconductor computing. Explore how our etch and deposition solutions enable 3D transistors, including FinFET, gate-all-around, and more. https://bit.ly/4ow9dPh

The EUV lithography process is a piece of cake with Aether® dry resist + development. 🍰 Here’s how it enables higher yield for the next generation of semiconductor devices. ⬇️ https://bit.ly/4gMXYh4

See how we use virtual twins to catch etch loading effects that impact uniformity and yield, faster and at a lower cost than traditional testing. https://bit.ly/3KTuHHn

Revisiting Lam milestones from the past. 🪣⛏️ See what’s in our 1988 time capsule.

Our contributions to the Colorado School of Mines earned us the Mines@150 Visionary award! See how we support semiconductor research in higher education via the blog. https://bit.ly/3JdcWlN

When chips get complex, Akara® gets precise. Shrinking architectures and rising performance demands don’t leave much room for error — but that’s exactly where our newest conductor etch system, Akara®, shines. ✨ Tap the link to explore. bit.ly/4i5iURo

Hot off the press from SEMICON West: Lam Cryo ™ 3.0 earned us the 2025 SEMI Award. 🏆🎉 Check it out. https://bit.ly/48spTm9

Ready for another Word of the Week? Today’s word is capacitor, a component that stores an electric charge in logic and memory chips, consisting of conductors separated by an insulator.⚡ https://bit.ly/4nGxfaa

Time is everything in semiconductor manufacturing. Fabtex™ Yield Optimizer reshapes the path to high yields by combining AI, machine learning, and digital twins with real fab data. The result: fewer iterations, faster ramp, and reduced scrap. Discover more. https://bit.ly/47bVMxX

Building on decades of dielectric film and advanced packaging solutions, we introduced our most advanced deposition tool to date. Learn how VECTOR® TEOS 3D delivers high-quality, void-free thick dielectric film deposition for advanced packaging.

Plasma etch is like a sculptor’s tool at the atomic level. See how our etch systems shape nanoscale features with precision. ➡️ https://bit.ly/4mji5qd

Where AI’s demand for massive computing creates challenges, advanced packaging offers a solution. Discover how advanced packaging enables the creation of powerful AI chips while optimizing performance, cost, and more. https://bit.ly/42GBLwW

Enter the advanced packaging era. Watch our advanced packaging tools solve etch, bond, and deposition challenges layer by layer, die by die.

A redistribution layer is like GPS on a wafer, allowing chipmakers to re-route conductive points during the packaging process and improve overall chip performance! 🛣️🚗 Our SABRE® 3D products use this extra metal layer — learn more. https://bit.ly/46T6old

Leveraging our deep expertise in atomic layer deposition (ALD), we created ALTUS® Halo. See how our next generation ALD tool enables a new era of semiconductor metallization with the adoption of molybdenum. bit.ly/4mrZg3N