John Kibarian, CEO of PDF Solutions, talks with SE’s Ed Sperling about the growing role of AI in chip manufacturing, the impact of 3D-ICs on the supply chain, and how to shorten cycle time to get leading-edge chips and multi-die assemblies to market more quickly. semiengineering.com/big-changes-...

HBM4 Sticks With Microbumps, Postponing Hybrid Bonding semiengineering.com/hbm4-sticks-... #HBM4

Always an interesting quarterly report to peruse. Here's where the investments are going. Don't miss the chart at the end semiengineering.com/startup-fund... #semiconductor

AI/ML are driving a steep ramp in neural processing unit (NPU) design activity for everything from data centers to edge devices such as PCs and smartphones. 6 experts discuss how and why to optimize NPUs. semiengineering.com/how-and-why-... #NPU

Latest news in the semiconductor industry semiengineering.com/chip-industr... #semiconductor

With the rise in AI, data-center power density has grown to the point where liquid cooling is now seeing a larger buildout. Single-phase cooling predominates currently, but 2-phase & immersion cooling are also growing as options. semiengineering.com/liquid-cooli... #datacenters #cooling #AI

Data sharing is becoming critical at leading device nodes, where process variability is starting to consume ever-greater portions of the process margin. semiengineering.com/secure-data-... #semiconductor

In today’s AI-class devices, wafer probe has become one of the most mechanically aggressive and least forgiving steps in the entire flow. semiengineering.com/wafer-probe-... #semiconductor

Automotive Outlook: 2026 semiengineering.com/automotive-o... #automotive

New technical papers recently added to Semiconductor Engineering’s library: semiengineering.com/chip-industr... #semiconductor

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor #CES2026 #VLSI

“This is one of the problems of taking a design and disaggregating all the components into a set of heterogeneous chiplets” semiengineering.com/is-end-to-en... #semiconductor #hardwaresecurity #advancedpackaging

Special Report: Semiconductor companies announced a significant number of facilities in 2025 as global onshoring efforts continued across manufacturing, materials, packaging, design, and R&D. Don't miss the table at the end semiengineering.com/annual-globa... #semiconductor #fabs

Increased storage needs at the edge and in the cloud are fueling rising demand for higher-capacity flash memory across multiple applications. semiengineering.com/cryogenic-et... #3DNAND #FlashMemory #CryogenicEtch #semiconductor

You may find Semiconductor Engineering's Events page useful for planning your attendance at the best chip industry conferences in 2026. Good one to bookmark. semiengineering.com/semiconducto... #semiconductor

Semiconductor Engineering gathered a group of 6 experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. semiengineering.com/ai-workloads... #Edge

Latest news in the semiconductor industry semiengineering.com/chip-industr... #semiconductor

New technical papers recently added to Semiconductor Engineering’s library semiengineering.com/chip-industr... #semiconductor #DDR5 #powergating #chiplets #MEMS

What chip industry engineers were watching this year. Hottest topics: verification, agentic AI, DRAM/HBM, optimization of data movement, chiplets, heterogeneous integration. semiengineering.com/top-chip-ind... #semiconductor #DRAM #verification #chiplets #semiconductormanufacturing #techtalks

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor

2025 has certainly been a year of unexpected changes. These had a big impact on the semiconductor industry & everything that supports it. Not all the changes have been bad, but flexibility has been a requirement for continued success semiengineering.com/2025-a-year-... #semiconductor

Semiconductor Engineering's latest special report: Programmable Chips Evolve For Shifting Needs semiengineering.com/programmable...

Semiconductor Engineering gathered a group of 6 experts to discuss why some AI workloads are better suited for on-device processing to achieve consistent performance, avoid network connectivity issues, reduce cloud computing costs, and ensure privacy. semiengineering.com/ai-workloads... #Edge

Reliability Risks Shift To The Materials Stack: How polymer behavior, panel mechanics, and thermal coupling affect reliability in 3D integration. semiengineering.com/reliability-... #semiconductor

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor

Interposers and bridges, two of the key elements for interconnecting multiple chips and chiplets in an advanced package, are undergoing fundamental changes in how they’re built and assembled. semiengineering.com/whats-next-f... #semiconductor #chiplets #advancedpackaging

New technical papers recently added to Semiconductor Engineering’s library semiengineering.com/chip-industr... #AI #quantum #chiplets #semiconductor

Generative AI In Chip Manufacturing semiengineering.com/generative-a... #semiconductor #GenAI

Simulations of semiconductors and systems are becoming bigger, more complex, and increasingly necessary, mirroring everything that is happening to the hardware itself — particularly in AI data centers. semiengineering.com/ai-buildout-... #simulations #AIDataCenters #datacenters

Limited by Power semiengineering.com/limited-by-p...

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor

Semiconductor Engineering's latest special report semiengineering.com/chiplets-vs-... #chiplets

Real-time security clearances are becoming increasingly common in manufacturing of advanced-node semiconductors, where data sharing is both essential and a potential security threat. semiengineering.com/zero-trust-d... #semiconductor #ZTAs #ZeroTrustArchitectures #cybersecurity

3D NAND drives 3D metrology and inspection technology to new extremes. semiengineering.com/metrology-di... #3DNAND

Robots are becoming smarter, more capable, and more pervasive, setting the stage for a whole new round of growth that will touch nearly every part of the semiconductor and software industries for decades to come. semiengineering.com/physical-ai-...

Artificial intelligence for quantum computing semiengineering.com/ai-technique... #quantumcomputing #AI

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor

The rollout of edge AI is creating new security risks due to a mix of small language models (SLMs), their integration into increasingly complex hardware, and the behavior and interactions of both over time. semiengineering.com/small-langua... #edge #SLMs #hardwaresecurtiy

Optimizing AI Workloads For Edge Computing Performance enhancement, cost reduction, data security, and improved energy efficiency are the end goals for optimizing AI workloads at the edge. Part 2 of series with 6 experts. semiengineering.com/optimizing-a... #edgecomputing #AIworkloads

Designing resilient chips with SLM can help combat aging effects, security threats, and get to market faster with higher yields. semiengineering.com/the-real-wor... #semiconductor #EDA #SiliconLifecycleManagement #chiparchitecture

3DKs: Making Headway On Chiplet Standards semiengineering.com/3dks-making-... #chiplets

FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. semiengineering.com/fpgas-find-n... #FPGA

Latest news in the chip industry semiengineering.com/chip-industr... #semiconductor

Challenges In Testing Photonics In Chips: The impact of combining electrical and optical test in a single device. youtu.be/NFd-zv0ohE8?... #photonics

Given the pace of innovation in all kinds of AI, it is clear that the industry can expect to see rapid improvements both within the EDA tools, and in agentic AI tools that can help to relieve engineers from some of the burdensome tasks involving tool iteration. semiengineering.com/ai-plays-mul...

AI-Driven Collaboration In Chip Manufacturing: How agents can shorten time to market through secure sharing of data by machines. youtu.be/z3qd4aLUuU0?... #semiconductor #AgenticAI

New Panel Production Efforts Target Interposer Costs: semiengineering.com/new-efforts-... A pilot line will attempt to dial in a volume process for large organic interposers. #semiconductor

As data center infrastructures adapt to evolving workloads, parts of Ethernet can be found in scale-up approaches. semiengineering.com/multiple-ai-... #ScaleUp #Ethernet #UltraEthernet #ESUN